Applications

Corelase develops laser systems and components for material processing applications. Material processing can be broadly divided into two dimensions:

• Macro machining
• Micro machining

Corelase has addressed these markets by developing new types of continuous wave (cw) and pulsed fiber lasers. Additionally we offer diode lasers integrated into standalone systems for soldering and welding applications.

Macro machining deals with features typically larger than 100 microns and mainly utilizes high power (>50W) continuous wave (cw) lasers. When cw laser light hits a material surface, the typical interaction result is solid-liquid transition i.e. melting. Thus these lasers are most suitable for soldering and welding applications. With very high power densities, it is also possible to cut material by partial melt removal and evaporation (= laser ablation).

Micro machining deals with features less than 100 microns and mainly utililizes low power (<50W) pulsed lasers. With pulsed lasers, it is easier to reach very high power densities at a target. This favours solid-(liquid)-vapour transition. Thus cleaner cutting without debris and liquid spitting is achieved. In addition the ablated material can be used for coating other surfaces. Such pulsed laser deposition opens new exciting applications that so far are addressed with vacuum thermal evaporation and sputtering methods.