CoreBond™ – Corelase’s own fiber laser micro welding
Corelase has developed company’s own fiber laser micro welding processes. Picosecond fiber laser process provides the possibility of joining two transparent materials together hermetically and without adhesives. CoreBond™ was designed and developed for glass/glass, silicon/glass and sapphire/sapphire welding.
Low investment cost
CoreBond process utilizes picosecond fiber laser X-LASE that combines high processing quality and speed, simple and flexible process, low investment cost and environmentally safer process to one package. Picosecond pulses combined with patented CoreScribe™ and CoreBond processes enable high quality processing, which increases yields. It’s a valuable benefit when trying to decrease the manufacturing costs of for example MEMS or LED devices.