Soldering

Laser soldering has become more attractive solution.

There is a growing need for technologies to solder through-hole assemblies in a selective, reliable, automated, and timely-manner. Today's electronics package is one where interconnects and functionality is increasing with a concomitant increase in the mix of surface mount and through-hole devices. High density component lead / pin spacing will drive new solutions for selective soldering. 

Lead-free solders require higher soldering temperatures than earlier tin-lead solders. This has created a problem because traditional methods exceed the acceptable thermal load. Future trends in optoelectronics and MEMS will further enforce the need for selective soldering technologies. The selection of the appropriate soldering method has always depended on cycle time requirement, volume, component spacing and cost. Because of all the above reasons selective laser soldering has become more and more attractive solution.

Corelase offers compact, efficient and flexible solution for laser soldering.
Soldering video (wmv, 1.42 MB)