Ablation and scribing – Efficient and fast
USP lasers can be used for removing material from the surface of workpiece by ablation. The ablation process can be applied selectively for patterning various structures. Corelase X-LASE with optimized picosecond pulses, high peak power and small spot size creates real value adding benefits to customers.
Corelase’s own process
Corelase has developed a laser ablation and scribing process, which is based on picosecond fiber laser, X-LASE. X-LASE combines high processing quality and speed, simple and flexible process, low investment cost and environmentally safer process to one simple package. It improves quality and capability to process thin films on glass and on polymer substrates.