Ablation and scribing – Efficient and fast

USP lasers can be used for removing material from the surface of workpiece by ablation. The ablation process can be applied selectively for patterning various structures. Corelase X-LASE with optimized picosecond pulses, high peak power and small spot size creates real value adding benefits to customers.

Corelase’s own process

Corelase has developed a laser ablation and scribing process, which is based on picosecond fiber laser, X-LASE. X-LASE combines high processing quality and speed, simple and flexible process, low investment cost and environmentally safer process to one simple package. It improves quality and capability to process thin films on glass and on polymer substrates.

Related Products

X-LASE

News

  • Corelase was awarded ISO9001:2015 Certificate

    The Corelase Quality Management System audit at the end of June was a success and was performed according to the newest ISO9001:2015 standard. The awarded certificate can be found here. …Read More »
  • Precisely for customers

    Corelase underlines that innovation is customer service. Corelase is an expert of quality turnkey laser technology. The company emphasizes that the most important thing in their business is about listening …Read More »

Events

2016 Japan International Welding Show, Osaka, Japan

13th to 16th April 2016

Laser World of Photonics, Munich, Germany

26th to 29th June 2017

ALL EVENTS