CoreBond™ – Corelase’s own fiber laser micro welding

Corelase has developed company’s own fiber laser micro welding processes. Picosecond fiber laser process provides the possibility of joining two transparent materials together hermetically and without adhesives. CoreBond™ was designed and developed for glass/glass, silicon/glass and sapphire/sapphire welding.

Low investment cost

CoreBond process utilizes picosecond fiber laser X-LASE that combines high processing quality and speed, simple and flexible process, low investment cost and environmentally safer process to one package. Picosecond pulses combined with CoreScribe™ and CoreBond processes enable high quality processing, which increases yields. It’s a valuable benefit when trying to decrease the manufacturing costs of for example MEMS or LED devices.

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2016 Japan International Welding Show, Osaka, Japan

13th to 16th April 2016

Laser World of Photonics, Munich, Germany

26th to 29th June 2017