Ablation and scribing – Efficient and fast

USP lasers can be used for removing material from the surface of workpiece by ablation. The ablation process can be applied selectively for patterning various structures. Corelase X-LASE with optimized picosecond pulses, high peak power and small spot size creates real value adding benefits to customers.

Corelase’s own process

Corelase has developed a laser ablation and scribing process, which is based on picosecond fiber laser, X-LASE. X-LASE combines high processing quality and speed, simple and flexible process, low investment cost and environmentally safer process to one simple package. It improves quality and capability to process thin films on glass and on polymer substrates.

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2016 Japan International Welding Show, Osaka, Japan

13th to 16th April 2016

Laser World of Photonics, Munich, Germany

26th to 29th June 2017